High conductivity. Uniform sidewall coverage. Fewer process steps.
Electroninks brings particle-free silver technology to electronics manufacturing.
Partners in advanced materials and manufacturing
Sputtering travels in straight lines, so it struggles to reach sidewalls inside a narrow dicing trench.
Electroninks uses a molecular silver solution that reaches the gap instead.
Particle-free silver reaches trenches as narrow as 50 microns and coats areas vapor struggles to reach.
Coat the packages where they sit instead of lifting and re-spacing them on a second tray.
No vacuum chamber is required for the spray coating step.
Choose the grade based on what you are coating rather than forcing one formulation across every surface.
Particle-free silver uses metal at the molecular level instead of suspended particles. That helps the ink flow into tighter features, sidewalls, and complex package geometries before forming a dense conductive silver layer during processing.
High adhesion silver MOD ink for difficult surfaces
EI-1206 is a high adhesion silver MOD ink for spray coating. It forms conductive silver films on surfaces where getting a strong bond can be difficult.
Use EI-1206 on silicon, glass, alumina and gallium arsenide. It is the high adhesion grade when bonding to the material is one of the main process requirements.
EI-1206 is designed for surfaces where adhesion matters most. It gives manufacturing teams a conductive silver coating while prioritizing dependable bonding to difficult materials.
Electroninks enables your newest innovations with high-performance, cost-effective, and reliable metal complex conductive ink solutions
Dense silver films provide a conductive layer for EMI shielding on electronic packages.
Spray coating reaches sidewalls and corners that are difficult to coat with line of sight deposition.
Coat closely spaced packages with a process that can remove the need for reconstitution.
Apply conductive silver in air using spray coating instead of vacuum deposition equipment.
Add shielding directly to package surfaces where space and geometry matter.
A range of metal complex inks supports different coating, printing and substrate requirements.
Electroninks develops particle-free metal inks for manufacturing teams that need better coverage, more substrate options, and fewer process constraints.
Electroninks MOD inks contain metal in solution rather than suspended particles. That helps form dense conductive films without the particle size limits of conventional pastes.
Spray coated MOD inks can reach sidewalls, corners, and narrow package gaps that are difficult for line of sight PVD or particle based materials to cover consistently.
Choose between high adhesion, high conductivity, or lower temperature processing depending on the substrate and application. Electroninks gives engineers more room to match the material to the manufacturing process.
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